Static Component Interconnection Test Technology (SCITT)
نویسنده
چکیده
In a collaboration initiated in 1997, Fujitsu and Philips have jointly developed a Design-for-Test methodology to facilitate assembly interconnection testing of complex memory devices. Complex memories require an initialisation sequence or are accessed by a more complex protocol and therefore complicate assembly test – examples are SDRAM, FCRAM and Flash. With the trend towards smaller pin pitch and chip scale packages (CSP) for memories, testing of solder connections becomes ever more complicated and expensive.
منابع مشابه
Static component interconnection test technology in practice
Static Component Interconnection Test Technology (SCITT) is a new XNOR circuit based technology that is used for board-level interconnection test. SCITT provides an easy test method using simple patterns and results in a high diagnostic resolution. The method is especially suited for SDRAM and other ‘complex memories’ but can be used for other devices as well. Very little overhead is required. ...
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تاریخ انتشار 1999